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W7
8W7
10W7
12W7
13W7
W6v2
10W6v2
12W6v2
13W6v2
TW5
13TW5
W3v3
6W3v3
8W3v3
10W3v3
12W3v3
13W3v3
W1v2
8W1v2
10W1v2
12W1v2
13W1v2
W0v2
10W0v2
12W0v2
15W0v2
WX
10WX
12WX
Discontinued

 

cooling

Reviews
W6v2 Technologies
Recommended Power Chart

W6v2 Technologies: Elevated Frame Cooling
Summary:
The elevated frame design of the W6v2 delivers cool air through slots directly above the top-plate to the voice coil of the speaker. This not only enhances power handling, but also sound quality by minimizing dynamic parameter shifts and power compression.

Detailed Information:

Many speakers employ venting techniques to enhance voice coil cooling. This is typically accomplished by having big holes in the sides of the frame just below the spider attachment shelf. While it provides a modest cooling benefit, this low-velocity air-flow does not blow directly or strongly on the voice coil.

Our patented design improves upon this cooling technique in a number of ways. By elevating the frame above the top-plate of the motor (via stand-offs integrated into the bottom of the frame) a narrow, high-velocity air-path is created between the bottom surface of the frame and the top surface of the top-plate. This air path leads directly to the voice coil and then turns upward into the spider air cavity. By utilizing the pumping action of the spider through this focused air path, a large volume of cool air hits the coil windings directly.
 














 
 
Another important benefit is that the upper surface of the top-plate (one of the speaker's hottest parts) is directly exposed to cooling air flow, whereas on a conventional design it is isolated from the air flow by the lower flange of the frame. The elevated frame technology greatly increases thermal power handling, reduces compression effects and does so without any additional parts.

 

 
     
 
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